首页> 外文会议>IEEE International Vacuum Electronics Conference >Analysis of thermal interface resistivity of a helix TWT slow-wave structure
【24h】

Analysis of thermal interface resistivity of a helix TWT slow-wave structure

机译:螺旋TWT慢波结构的热界面电阻率分析

获取原文
获取外文期刊封面目录资料

摘要

The thermal interface resistivity (TIR) of the helix slow-wave structure (SWS) is studied theoretically and experimentally. The effects of the TIRs at different interfaces on heat dissipation capability of the SWS have been analyzed and compared using ANSYS. The TIRs at the helix-rod interface and the rod-barrel interface have been calculated respectively with the developed equations and the measured component temperatures, considering the temperature- -dependent material properties. The effects of the rod material and the assembly method on the TIRs of the SWS were analyzed and compared.
机译:理论上和实验研究了螺旋慢波结构(SWS)的热界面电阻率(TIR)。通过ANSYS分析并与SWS的散热能力不同接口对不同频率的影响。考虑到温度依赖的材料特性,分别利用所开发的方程和测量的部件温度分别计算螺旋杆界面和杆筒界面的TIRS。分析并比较了杆状材料和组装方法对SWS TIR的影响。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号