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CFD Assisted Design Evaluation and Experimental Verification of a Logic Controlled Local PCB Heater for Humidity Management in Electronics Enclosure

机译:电子机箱湿度管理逻辑控制本地PCB加热器对逻辑控制本地PCB加热器进行辅助设计评价及实验验证

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Humidity management of commercial-of-the-shelf electronic components in non-controlled climatic environments can be realized e.g. by introducing a local printed circuit board heater. By choosing appropriate size and location of the heater plate in the vicinity of the critical electronic packages, and utilizing logic control function, it is possible to improve the quality of local humidity management and reduce power consumption of the heater, which is important especially in case of battery driven portable or vehicle mounted devices. A computational fluid dynamics assisted methodology has been developed to determine the best feasible design of the heater, followed by experimental verification of the constructed logic controlled heater. The experiment has been performed in a harsh climatic environment including temperature variation from +33°C to +40°C, and relative humidity variation from 54% to 80%. Analysis of the experimental %RH and temperature curves as well as power profile of the heater has confirmed the feasibility of the chosen approach to maintain greater than 9°C difference between the electronics package surface temperature and the local dew point temperature, by applying discrete power pulses with the amplitude less than 6 W.
机译:例如,可以实现非受控气候环境中商业包装电子元件的湿度管理。通过引入局部印刷电路板加热器。通过在关键电子封装附近选择加热器板的适当尺寸和位置,并利用逻辑控制功能,可以提高局部湿度管理的质量,并降低加热器的功耗,这是特别的情况下重要的电池驱动的便携式或车辆安装设备。已经开发了一种计算流体动力学辅助方法来确定加热器的最佳可行性设计,然后是构造的逻辑控制加热器的实验验证。该实验已经在恶劣的气候环境中进行,包括从+ 33℃至+ 40℃的温度变化,相对湿度变化为54%至80%。通过施加离散功率,可以通过施加离散功率来分析所选择的方法的实验性%RH和温度曲线以及电力曲线的可行性,以通过应用离散功率来维持在电子封装表面温度和局部露点温度之间大于9°C的差异。幅度小于6 W.

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