首页> 外文会议>International Microsystems, Packaging, Assembly and Circuits Technology Conference >THERMAL CHARACTERIZATION OF HIGH THERMAL CONDUCTIVE GRAPHITES REINFORCED ALUMINUM MATRIX COMPOSITES
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THERMAL CHARACTERIZATION OF HIGH THERMAL CONDUCTIVE GRAPHITES REINFORCED ALUMINUM MATRIX COMPOSITES

机译:高导热石墨增强铝基复合材料的热表征

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摘要

Due to the development of high power density and high heat flux of IC and LED components and devices, the thermal management of microelectronics has become a very critical issue in 3C and optoelectronic industries. This has lead to the requirement of high thermal performance materials and thermal modules. To enhance the thermal performance of current thermal modules, it is very important to develop advanced thermal management materials to replace the conventional monolithic metals. In this study some kinds of graphites reinforced aluminum matrix composites were developed. The effects of reinforcement types and its volume fraction on thermal properties such as thermal conductivity as well as the thermal expansion coefficient were studied. Moreover, their thermal performance such as heat spreading resistance and thermal resistance compared to pure aluminum and copper were also conducted. From the results, it showed that the thermal conductivity of graphite/Al composites can reach to 500~600 W/m.K in X-Y plane and 40~100 W/m.K in cross plane with thermal expansion less than 10 ppm/K and density less than 2.5 g/cc; The spreading resistance of this composite is 2~5% lower than the one of pure copper, and 25 % lower than the one of pure aluminum.
机译:由于高功率密度和IC和LED部件和器件的高热量通量的发展,微电子的热管理已成为3C和光电行业的一个非常关键的问题。这导致了高热性能材料和热模块的要求。为了提高电流热模块的热性能,开发先进的热管理材料以更换传统的整体金属是非常重要的。在这项研究中,开发了一些石墨石墨石墨铝基基复合材料。研究了增强类型及其体积分数对热性能的影响,例如导热系数以及热膨胀系数。此外,还进行了与纯铝和铜相比的热膨胀电阻和热阻等热性能。从结果来看,它表明石墨/ Al复合材料的导热率可以在XY平面中达到500〜600W / mk,在横平面中的40〜100W / MK,热膨胀小于10ppm / k,密度小于10 ppm / k和密度2.5 g / cc;该复合材料的扩散性比纯铜的散热率低2〜5%,比纯铝中的一个低25%。

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