首页> 外文会议>International Microsystems, Packaging, Assembly and Circuits Technology Conference >Investigation of data distribution effect in Random Forest Machine Learning Algorithm for WLCSP Reliability Prediction
【24h】

Investigation of data distribution effect in Random Forest Machine Learning Algorithm for WLCSP Reliability Prediction

机译:WLCSP可靠性预测随机林机学习算法数据分布效应研究

获取原文
获取外文期刊封面目录资料

摘要

In recent years, due to the consumer market become larger and larger, the electronic equipment improves every day, we pay more and more attention to the reliability of electronic packaging. Electronic packaging is a complex structure that protects IC devices and plays an important role in the semiconductor industry. Our research aims to evaluate the reliability of electronic packaging, and Thermal Cycling Testing (TCT) is one of the important tests to ensure packaging reliability. TCT is a good way to test electronic packaging reliability, but it takes a lot of time and cost to do this experiment. The time required to perform a TCT can be as long as several months or years. In order to effectively reduce the test time, we often use the Finite Element Method (FEM) instead of TCT.Although FEM takes less time than TCT, it still takes some time to use the FEM to get the simulation result. We build the model according to different parameters and fixed boundary conditions, and then apply the thermal cycle load on the model to obtain the prediction life value of the electronic package. Different researchers may lead to different results, even if they use the same model parameter. If we use a large amount of validated FEM data to build a database for machine learning(ML), then we can immediately evaluate the electronic package prediction life through machine learning methods. It not only saves the time to build the model and validation, but also avoid the simulation error.This research is to use the ML method to analyze the reliability of Wafer Level Chip Scale Packaging (WLCSP). ML can find potential rules of data sets through algorithms, establish mathematical models, and obtain prediction life of different WLCSP structures. For the same data set, different algorithms may get different results. So, choosing the suitable algorithm is the most important step in using machine learning algorithm. This research uses a Random Forest algorithm (RF) and Extremely Randomized Trees (ET) algorithm to evaluate the reliability of WLCSP. The training database was generated by FEM and compared with the TCT experimental results to verify the FEM model. After obtaining the verified FEM model, in the same modeling process, we design feature levels to generate multiple data sets with different data volumes and different data distributions. Discuss the impact of data volume and data distribution on the RF model and ET model.
机译:近年来,由于消费市场变得更大,更大,电子设备每天都会改善,我们越来越多地关注电子包装的可靠性。电子包装是一种复杂的结构,可保护IC器件并在半导体行业中发挥重要作用。我们的研究旨在评估电子包装的可靠性,热循环测试(TCT)是确保包装可靠性的重要测试之一。 TCT是测试电子封装可靠性的好方法,但这需要花费大量的时间和成本来实现这一实验。执行TCT所需的时间可以长达几个月或多年。为了有效地减少测试时间,我们经常使用有限元方法(FEM)而不是TCT.虽然FEM需要比TCT更少的时间,但使用FEM仍然需要一些时间来获得仿真结果。我们根据不同的参数和固定边界条件构建模型,然后在模型上应用热循环负载以获得电子包的预测寿命值。即使他们使用相同的型号参数,也可能导致不同的结果。如果我们使用大量验证的有限元数据来构建机器学习(ml)的数据库,那么我们可以通过机器学习方法立即评估电子包装预测寿命。它不仅可以节省建立模型和验证的时间,而且还避免了模拟错误。这项研究是使用ML方法来分析晶圆级芯片刻度包装(WLCSP)的可靠性。 ML可以通过算法找到潜在的数据规则,建立数学模型,并获得不同WLCSP结构的预测寿命。对于相同的数据集,不同的算法可能会得到不同的结果。因此,选择合适的算法是使用机器学习算法的最重要步骤。该研究使用随机森林算法(RF)和极其随机的树木(et)算法来评估WLCSP的可靠性。培训数据库由FEM生成,与TCT实验结果相比,以验证有限元模型。在获得验证的有限元模型之后,在相同的建模过程中,我们设计具有不同数据卷和不同数据分布的多个数据集的特征级别。探讨数据量和数据分布对RF模型和ET模型的影响。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号