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Modeling of InP HBTs in transferred-substrate technology for millimeter-wave applications

机译:用于毫米波应用的转移衬底技术中的InP HBT建模

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In this paper, the modeling of InP heterojunction bipolar transistors (HBTs) in transferred substrate (TS) technology is investigated. At first, a direct parameter extraction methodology dedicated to III–V based HBTs is employed to determine the small-signal equivalent circuit parameters from measured S-parameters. It is shown that the model prediction of measured S-parameters can be improved in the millimeter-wave frequency range by augmenting the small-signal model with a description of AC current crowding. The extracted elements of the small-signal model structure are employed as a starting point for the extraction of a large-signal model. The developed large-signal model for the TS-HBTs accurately predicts the DC over temperature and small-signal performance over bias as well as the large-signal performance at millimeter-wave frequencies (77 GHz).
机译:本文研究了InP异质结双极晶体管(HBT)在转移衬底(TS)技术中的建模。首先,采用专用于基于III–V的HBT的直接参数提取方法,从测量的S参数确定小信号等效电路参数。结果表明,通过用交流电流拥挤的描述来增强小信号模型,可以在毫米波频率范围内改善测量到的S参数的模型预测。小信号模型结构的提取元素被用作大信号模型提取的起点。为TS-HBT开发的大信号模型可以准确地预测DC的温度范围和小信号的性能,以及偏置在毫米波频率(77 GHz)时的大信号性能。

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