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Synthesis and Characterization of ZnTe Thin Films on Silicon by Thermal-Furnace Evaporation

机译:热炉蒸发法在硅上合成ZnTe薄膜及其表征

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Zinc telluride (ZnTe) compound is one of the attractive elements of the Ⅱ-Ⅵ group also having wide range of applications such as switching devices, light-emitting diode, solar cells and photodetectors. In this paper, the microstructure and electrical properties of znic telluride thin films were studied by using thermal-furnace evaporation with emphasis on the effects of argon pressure and deposition temperature. Crystallinity, mobility, carrier concentration and sheet resistance are shown to be dependent on the argon pressure and deposition temperature. The grain size was increased with increasing the annealing temperature and decreasing the argon pressure. The highest carrier concentration of 1.9×10~(16) cm~(-3), the lowest sheet resistance of 3180 ohm/square and the largest mobility of 5.1×10~3 cm~2V~(-1)S~(-1) are presented at an argon pressure of 100 sccm and a deposition temperature of 580°C, respectively.
机译:碲化锌(ZnTe)化合物是Ⅱ-Ⅵ类的诱人元素之一,还具有广泛的应用,例如开关器件,发光二极管,太阳能电池和光电探测器。本文通过热炉蒸发研究了碲化锌薄膜的微观结构和电学性能,重点研究了氩气压力和沉积温度的影响。结晶度,迁移率,载流子浓度和薄层电阻显示为取决于氩气压力和沉积温度。晶粒尺寸随着退火温度的升高和氩气压力的降低而增加。最高载流子浓度为1.9×10〜(16)cm〜(-3),最低薄层电阻为3180 ohm / square,最大迁移率为5.1×10〜3 cm〜2V〜(-1)S〜(- 1)分别在100sccm的氩气压力和580℃的沉积温度下给出。

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