Die attach capability on ultra thin wafer thickness for power semiconductor

摘要

In the fast- paced semiconductor industry the need for package solution arises in order to cope with emerging miniaturization trend. As wafer thickness decreases to 100µm and below, manufacturing challenges arise. Ultra-thin wafers are less stable and more vulnerable to stresses, and the die can be prone to breaking and warping not only during grinding but also at subsequent processing steps.Thinner dies will be able to perform faster heat dissipation to the Cu leadframe to improve the Rth and at the same time will be able to improve the Rdson performance. An effort to assemble an Ultra Thin Dies has been made at die bonding using soft solder, solder paste and also Au Sn Diffusion Soldering.