A compact thermal model to predict the junction temperature of high power light emitting diode package

摘要

In this study, the thermal resistance of a typical LED package was analyzed and a compact thermal model (CTM) was obtained by considering the configuration of each layer of LED package. The building of the CTM was presented in detail. Experiments and finite element simulations were conducted to validate the CTM. The error of the thermal resistance obtained by the CTM and simulations were less than 2% when being referred to the experiments. The comparison results demonstrate that the present CTM can be used to obtain the thermal resistance of the package and to predict the junction temperature.