首页> 外文会议>Symposium for passive electronic components >The Benefits of Polyalkylene Carbonate Binders (QPAC~®) for Low Temperature Glass Frit or Powdered Glass in Low Temperature Processed Thick Film Applications
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The Benefits of Polyalkylene Carbonate Binders (QPAC~®) for Low Temperature Glass Frit or Powdered Glass in Low Temperature Processed Thick Film Applications

机译:聚亚烷基碳酸酯粘合剂(QPAC〜®)在低温加工厚膜应用中对低温玻璃料或粉末玻璃的好处

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QPAC® 40 Poly(Propylene Carbonate), or PPC is an exceptional binder for use in low temperature firing thick film pastes because it decomposes at low temperatures leaving minimal residue after debind. The binder's low decomposition temperature allows for binder thermolysis at temperatures well below the sintering temperature of glass and metal powders that are used in ultra-low firing thick film applications. The potential for dramatically reduced levels of remnant carbon after thermal processing enables improvement in the mechanical, optical and electronic properties of a fired thick film device. Additionally, it is proposed that the use of clean burnout QPAC® binders will enable increased utilization of thermal processing equipment and will result in a reduction in periodic maintenance for removal of binder tars and the like from manufacturing thermal processing equipment, both which will reduce manufacturing costs and associated per device costs. In this paper glass pastes using QPAC® PPC carbonate binders were studied. Thermal analyses of the rate of debinding of thick film glass pastes made with ultra-low firing (420 °C) glass were performed and compared with analogous thick film pastes made with other common thick film binders as well as a commercially available ultra-low fire thick film paste. Rheological properties of the constituent binder vehicles as well as the respective thick film pastes were also evaluated and compared. The resulting fired thick film samples were also visually inspected and the QPAC® fired thick films most closely resembled the color of the fired neat glass powder, while the fired thick films made from other common thick film binders were much darker, indicating high levels of remnant carbon and possibly chemical reduction of the ultra-low firing glass. These obvious advantages can be applied to numerous low fire thick film applications including glass packaging, solder glass, sealing glasses, phosphors, dopants, and other solar cell device and display sealing applications.
机译:QPAC®40聚碳酸丙烯酯或PPC是一种出色的粘合剂,可用于低温烧成厚膜浆料,因为它在低温下分解,解胶后残留物最少。粘结剂的低分解温度允许粘结剂在远低于超低烧制厚膜应用中使用的玻璃和金属粉末烧结温度的温度下进行热解。热处理后残留碳含量显着降低的潜力可以改善烧制厚膜器件的机械,光学和电子性能。另外,提出使用清洁的燃尽QPAC®粘合剂将能够提高热处理设备的利用率,并且将减少从制造热处理设备中去除粘合剂焦油等的定期维护,这都会减少制造量。成本和每台设备的相关成本。在本文中,对使用QPAC®PPC碳酸盐粘合剂的玻璃浆料进行了研究。对由超低烧制(420°C)玻璃制成的厚膜玻璃糊的脱脂率进行了热分析,并将其与由其他普通厚膜粘合剂以及市售的超低烧成的类似厚膜糊进行比较厚膜糊。还评估并比较了组成粘合剂媒介物以及相应的厚膜糊剂的流变性质。还可以目视检查所得的烧制厚膜样品,并且烧制后的QPAC®厚膜的颜色与烧制后的纯净玻璃粉的颜色最相似,而由其他常见的厚膜粘合剂制成的烧制厚膜则要深得多,表明残留的水平很高碳,并可能对超低烧玻璃进行化学还原。这些明显的优势可应用于众多低火厚膜应用,包括玻璃包装,焊料玻璃,密封玻璃,荧光粉,掺杂剂以及其他太阳能电池设备和显示器密封应用。

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