Along with the infrared technical rapid development, infrared radiation (IR) infrared thermal image technology is widely applied in nondestructive testing. In this paper, the theoretical basis of IR thermal imaging technology and the method of emissivity and background correction are introduced. The thermal characteristic of one kind of packaging device was studied using infrared thermal imaging technology and FEM (Finite element method), for example, microwave module. Through the comparison and analysis of the infrared images of one type of microwave module at working condition, the junction temperature of electronic chips is obtained.
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