The Thermal Simulation Analysis Based on Cooling Structure of the High Power LED

摘要

At present,high power LED of 1 w have been applied widely in many aspects,such as general lighting,LED lamps for decorative lighting,LED lighting for construction,LED street lamps and so on,thus the demand of product is big.However,the cost is high and the process is complex.The article designs a new package structure aiming at the defect,at the same time,simulates and analyzes the temperature field of the current traditional package structure of high power of 1w and the new structure using the software of thermal simulation.Through the contrast,we can obtain the following results:when it achieves the balance of heat steady state,the highest temperature of traditional high power chip of 1w is 87.6 °C,and the highest temperature of the chip of the new package structure is 71.5°C under the action of the natural convection.The temperature of chip is higher,the attenuation is faster,thus the new package structure can effectively improve cooling performance of LED and increase the stability and reliability of the chip.Furthermore,the process is simple and cost is lower.