首页> 外国专利> Electronic component e.g. power transistor, cooling unit, has base unit, with which component to be cooled is thermally connected, and cooling units that are pencil-shaped and are material-conclusively connected with base unit by soldering

Electronic component e.g. power transistor, cooling unit, has base unit, with which component to be cooled is thermally connected, and cooling units that are pencil-shaped and are material-conclusively connected with base unit by soldering

机译:电子元件例如功率晶体管,冷却单元,具有基座单元,与之冷却的部件热连接,以及铅笔状的冷却单元,其材料通过焊接与基座单元确定性地连接。

摘要

The unit has a base unit (14), with which a component or a module to be cooled is thermally connected. A set of cooling units (22) is connected with the base unit and stays away from the base unit. The cooling units are pencil-shaped and are material-conclusively connected with the base unit by soldering. The cooling units are different or same in its length, its diameter, its geometry and its material.
机译:该单元具有基座单元(14),要冷却的组件或模块与该基座单元热连接。一组冷却单元(22)与基本单元连接并且远离基本单元。冷却单元为铅笔形,并通过焊接与基础单元材料连接。冷却单元的长度,直径,几何形状和材料不同或相同。

著录项

  • 公开/公告号DE202004020947U1

    专利类型

  • 公开/公告日2006-06-01

    原文格式PDF

  • 申请/专利权人 BEHR-HELLA THERMOCONTROL GMBH;

    申请/专利号DE20042020947U

  • 发明设计人

    申请日2004-12-15

  • 分类号H05K7/20;H05K1/02;H05K1/05;

  • 国家 DE

  • 入库时间 2022-08-21 21:20:04

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