Nobel Dielectric Metal Foil Substrates using Anodic Aluminum Oxide for Flexible Electronics

摘要

Nobel flexible substrates having thermal stability over 500 °C and dielectric voltage over 500 V using anodic aluminum oxide (AAO) are developed. Aluminum or aluminum-steel clad are used for the core metal. The coefficient of temperature expansion (CTE) of substrates are 5 or 10 ppm/K, respectively. In fabrication of the "Flexible Electronics", the aluminum core substrate can be applied for sheet-to-sheet process with a carrier using borosilicate glass. The clad core type having high temperature strength can be promising used for high temperature Web handling process over 500 °C.