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The characteristic analysis and optimization design for HgCdTe TDI infrared detector array

机译:HgCdTe TDI红外探测器阵列的特性分析和优化设计

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Time Delay Integration (TDI) is an effective approach for high sensitive infrared detectors. According to the principle of the TDI, the central distance of pixel along the time delay integral direction is closely linked with the specific application requirements. So the optimization design, such as the area of pixels and their distance, plays an important role to improve the performance of TDI detectors. The crosstalk between pixels is a crucial factor that results in the decline of detector Modulation Transfer Function (MTF), and then affects the imaging quality. In this paper the optimization design rule for the arrangement of pixel has been investigated. The results show that the main method to appreciate it is reducing the crosstalk between pixels and enhancing detectivity. Chips of which pixel areas and edge intervals are different but with same distance were designed for the experiments. The optical and electrical measurements were carried out for these chips and the optimized structure was obtained. In addition, relationships between the crosstalk and parameters of material, pixel structure were analyzed based on the experiment data. According to the comprehensive analysis of the measurement data, we obtained the optimum design for specific HgCdTe TDI infrared detector. Meanwhile it is also a well reference for other HgCdTe TDI detector structure design.
机译:时延积分(TDI)是高灵敏度红外探测器的一种有效方法。根据TDI的原理,像素在时间延迟积分方向上的中心距离与特定的应用要求紧密相关。因此,诸如像素面积及其距离之类的优化设计对于提高TDI检测器的性能起着重要作用。像素之间的串扰是导致检测器调制传递函数(MTF)下降并进而影响成像质量的关键因素。本文研究了像素排列的优化设计规则。结果表明,欣赏它的主要方法是减少像素之间的串扰并提高检测率。为实验设计了像素面积和边缘间隔不同但距离相同的芯片。对这些芯片进行了光学和电气测量,并获得了优化的结构。此外,根据实验数据分析了串扰与材料,像素结构参数之间的关系。通过对测量数据的综合分析,我们得到了针对特定HgCdTe TDI红外探测器的最佳设计。同时也为其他HgCdTe TDI检测器的结构设计提供了很好的参考。

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