Green manufacturing process for solder-less PCB assembly using uniform pressure surface interconnector and anisotropic conductive film

摘要

A new printed circuit board assembly (PBA) manufacturing process was invented and applied to replace conventional solder interconnection. For the realization of the new process, an unique equipment, uniform pressure surface interconnector (UPSI), was designed and fabricated. The new manufacturing method could save manufacturing cost and enhance yield. The UPSI demonstrated its effectiveness using anisotropic conductive films (ACFs) although it can be extended to non-conductive paste (NCP) application. In initial experiments, the feasibility of the new process was validated and electrical continuity was evaluated. Afterwards, additional experiments were performed to optimize process condition. In addition, the reliability of the newly fabricated PBAs was evaluated in thermal cycling test and high temperature/ humidity test.