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Looking for research results in components, materials, modeling, packaging, reliability and the other fields covered at ECTC?

机译：您是否正在寻找有关ECTC涵盖的组件，材料，建模，包装，可靠性和其他领域的研究结果？

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《61st Electronic Components Technology Conference, 2011 》|2011年|p.1|共1页
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机译：寻找研究成果，材料，材料，建模，包装，可靠性和ECTC覆盖的其他领域？
5. Thermomechanical properties of packaging materials and their applications to reliability evaluation for electronic packages. [D] . Ren, Wei. 2000

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