Post-semiconductor manufacturing processes (PSM), including packaging and printed circuit board (PCB) technologies, can be used to manufacture micro-electromechanical systems (MEMS) for sensing and actuation applications. MEMS devices have traditionally been produced using silicon processes, but recent advancements in packaging manufacturing technology have produced processes that can produce feature sizes small enough to be used for building microsystems. A lamination-based manufacturing process allows for a broader selection of materials and fabrication processes than silicon-based manufacturing, and therefore provides greater design freedom for producing functional microdevices. In many cases devices can be fabricated that are more suited to their applications than their silicon counterparts. Furthermore, such microdevices can be built with a high degree of integration, pre-packaged, and at low cost. Indeed, the PCB and packaging industries stand to benefit greatly by expanding their offerings beyond servicing the semiconductor industry and developing their own devices and products. This paper illustrates that good quality MEMS devices can be manufactured in laminates and discusses some of the unique benefits of such devices.
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