MEMS Packaging with 3D-MID Technology

摘要

3D-MID (three dimensional molded interconnect devices) technology (which is already broadly used for3D-MID mobile phone antennas) is also used for MEMS packaging and sensors applications. 3D-MID allowsminiaturization by the integration of mechanical and electronic functions in one part. The 3D electronic circuitis integrated into a 3D plastic casing or carrier, making it possible to achieve much more compact constructionand much greater function density. More and more applications involving electrical and electro-optical circuitsare made using 3D-MID technology. Typical 3D-MID applications are: Sensor packaging, LED packaging,security casings, RFIDs and Antennas. The main areas of application are in the automotive, medical, industrialtechnology and telecommunications sectors.