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Analysis and Control of Interface Reactions in Microelectronic Systems

机译:微电子系统中界面反应的分析与控制

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Multilayer, multicomponent architectures are ubiquitous in microelectronic systems over size scalesranging from microns to nanometers. During device fabrication and use reactions at component interfaces oftenoccur and lead to both beneficial and deleterious product phases. The analysis of the reactions is an essentialcomponent in developing strategies for reaction control. An effective approach for the analysis of interface reactionsis presented based upon the interpretation of the interface microstructure evolution in terms of the operativemulticomponent diffusion pathway where the influence of initially steep concentration gradients is included in theexamination of reaction phase sequencing. From the established diffusion pathway a novel kinetic biasing approachcan be devised as a robust means to engineer thermodynamic and mechanical compatibility including thedevelopment of an in-situ diffusion barrier. The degree of kinetic control can be augmented further by means oftailoring the diffusion pathways to establish the preferred interfacial reaction sequences. Furthermore, the extent ofthe interfacial control can be utilized to limit the formation of undesired interfacial reactions. The analysis andcontrol concepts are illustrated with an example from high temperature SiC applications.
机译:多层,多组件架构在微电子系统中无处不在 范围从微米到纳米。在设备制造和使用期间,通常会在组件界面发生反应 发生并导致有益和有害的产品阶段。反应分析是必不可少的 反应控制策略制定中的重要组成部分。分析界面反应的有效方法 基于对界面微观结构演变的解释 多组分扩散途径,其中初始陡峭的浓度梯度的影响包括在 检查反应阶段顺序。从已建立的扩散途径出发,提出一种新颖的动力学偏向方法 可以被设计为设计热力学和机械兼容性的可靠手段,包括 开发原位扩散屏障。动力学控制的程度可以通过以下方式进一步提高 调整扩散途径以建立优选的界面反应序列。此外,程度 可以利用界面控制来限制不期望的界面反应的形成。分析和 举例说明了高温SiC应用中的控制概念。

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