Packaging and Integration Concept for High-Performance and Cost-effective IQMbased Transmitter Module for 160 Gb/s Applications

摘要

Photonic packaging and interconnection design of Polarization Multiplexed RZ-DQPSK format are actuallygaining interests because of the urgent need to fit 100+ Gbit/s channels into existing DWDM systems, with theassociated advantage to use driving electronics at the effective speed-rate needed for each driving port.However, packaging and integration of IQM (In-phase/Quadrature Modulator) chips for 100+Gb/s applicationsposes huge design and process challenges. In this contribution, we present a systematic concept for efficient andcost-effective packaging and integration of a 4 × 43 Gb/s Polmux RZ-DQPSK transmitter module for 160 Gb/sapplications. This concept takes into consideration electrical and thermo-mechanical design challenges right atthe beginning of the design cycle, so as to prevent any system failure or possible re-designs. The two InP IQMchips are flip-chip bonded on a BGA-based ceramic package, preserving signal integrity, simplifying routingand dramatically minimizing overall size and assembly costs.