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FGTMR - Fine grain redundancy method for reconfigurable architectures under high failure rates

机译:FGTMR-高故障率下可重构架构的细粒度冗余方法

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For each new device generation based on smaller structures Single Event Errors (SEE) and intrinsic device faults gain more and more importance as device sensitivity increases. Triple Modular Redundancy (TMR) is a common reliability methodology for mitigating upsets and failures in architectures like modern Field Programmable Gate Arrays (FPGA). However for new device generations simply replicating complete systems may not be su#cient anymore especially in harsh environments, such as space applications, as higher failure rates may disturb a second instance before the faulty first one recovers. In this paper we focus on the Single Event Upset(SEU) mitigation challenges in nano scale architectures which can result in crucial situations. Our approach transforms the classical idea of TMR on module level down to a technological view based on FPGA architecture primitives. Such a fine grain approach allows to cope with several of the challenges caused by shrinking devices. This way the design can especially recover from multiple failures including Multiple Bit Upsets(MBUs). Moreover, we show how our approach can be integrated into standard tool flows thereby introducing TMR automatically. Finally we extend our idea to MBU tolerance by experiments.
机译:对于每个基于较小结构的新一代设备,随着设备灵敏度的提高,单事件错误(SEE)和内部设备故障变得越来越重要。三重模块冗余(TMR)是一种通用的可靠性方法,可缓解诸如现代现场可编程门阵列(FPGA)等架构中的故障和故障。但是,对于新一代设备而言,仅在整个恶劣的环境(例如空间应用)中复制完整的系统可能就不再足够了,因为更高的故障率可能会在故障的第一个实例恢复之前干扰第二个实例。在本文中,我们重点关注纳米体系结构中的单事件翻转(SEU)缓解挑战,这可能会导致紧急情况。我们的方法将模块级TMR的经典思想转换为基于FPGA体系结构原语的技术观点。这种细粒度的方法可以应付由收缩装置引起的若干挑战。这样,设计尤其可以从多种故障中恢复,包括多重位翻转(MBU)。此外,我们展示了如何将我们的方法整合到标准工具流程中,从而自动引入TMR。最后,我们通过实验将思想扩展到MBU容忍度。

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