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Frontside-only processing of 2-D MEMS scanner for miniature dual-axis confocal microendoscopes

机译:微型双轴共聚焦微内镜的二维MEMS扫描仪的仅前端处理

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We present a 2-D MEMS scanner for 3.2mm-diameter dual-axis confocal microendoscopes, which is fabricated by only front-side processing. Frontside-only processing greatly simplifies the process and reduces the cost of the fabrication. Furthermore, by removing the conventional backside etch window, the process enables solid, compact, and robust chip designs that significantly eases handling and packaging. To achieve 2-D imaging in dual-axis confocal microscopy, our scanner is gimbaled, but the outer frame of the gimbal is removed in order to minimize the size of the scanner chip. In static operation, the scanner has optical deflection angles of ∼±5.5° at 190V and ±3.8° at 100V for the outer and inner axes, respectively. At the torsional resonances, the optical deflection increases to ±11.8° at 1.18kHz for the outer axis and ± 8.8° at 2.76kHz for the inner axis, when the mirror is driven by (62 + 37sinωt)V and (68 + 37sinωt)V, respectively.
机译:我们介绍了一种用于3.2mm直径双轴共聚焦微型内窥镜的二维MEMS扫描仪,该扫描仪仅通过正面处理即可制造。仅前端处理极大地简化了过程并降低了制造成本。此外,通过去除常规的背面蚀刻窗口,该工艺实现了坚固,紧凑且坚固的芯片设计,从而大大简化了处理和封装。为了在双轴共聚焦显微镜中实现二维成像,我们的扫描仪是万向接头,但为了减小扫描仪芯片的尺寸,万向接头的外框已拆除。在静态操作中,扫描仪的外轴和内轴的光学偏转角分别在190V时约为±5.5°和在100V时约为±3.8°。在扭转共振下,当镜面由(62 +37sinωt)V和(68 +37sinωt)驱动时,外轴在1.18kHz处的光学挠度增加到±11.8°,内轴在2.76kHz处的光学挠度增加到±8.8° V,分别。

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