首页> 外文会议>2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference >Preparation of phosphinated bisphenol from acid-fragmentation of 1,1,1-tris(4-hydroxyphenyl)ethane and its application in high-performance cyanate esters
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Preparation of phosphinated bisphenol from acid-fragmentation of 1,1,1-tris(4-hydroxyphenyl)ethane and its application in high-performance cyanate esters

机译:1,1,1-三(4-羟苯基)乙烷的酸裂解制备次膦酸双酚及其在高性能氰酸酯中的应用

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Cyanate esters have received considerable attention because of their exceptional properties, such as good thermal stability, low water absorption, and low dielectric properties. They have been found to be particularly useful in the preparation of electrical and structural laminates, potting formulations, molding formulations, etc. Dicyanate esters are generally prepared by the reaction of bisphenol and cyanogen bromide in the presence of triethylamine at low temperature. The cyanate group undergoes trimerization to form the s-triazine ring and generates a thermoset with high cross-linking density. A large variety of cyanate esters with different backbone structures and properties have been synthesized and are summarized by Shimp et al.1 and Lin et al.2, respectively. Over the past decade, many new cyanate esters were developed. For example, Wang et al. prepared phenolphthalein-based cyanate esters with high-Tg for higher temperature applications.3 Snow et al. prepared fluoromethylene cyanate ester with lower Tg, dielectric constant, critical surface tension and water absorption.4 Lin et al. prepared a dipentene-containing cyanate ester with low moisture absorptions and low dielectric properties due to the hydrophobic character of the aliphatic dipentene structure.5 Although poly(cyanate esters) display promising properties, the lack of flame retardancy is a drawback of cyanate ester for electronic applications, where meeting a flame retardancy standard, UL-94 V-0, is required. Literatures have reported that the flame retardancy of cyanate esters can be greatly enhanced by the incorporation of phosphorus element.6–9
机译:氰酸酯因其优异的性能(如良好的热稳定性,低吸水率和低介电性能)而受到了广泛的关注。已经发现它们在电气和结构层压板,灌封配方,模塑配方等的制备中特别有用。通常通过双酚和溴化氰在三乙胺的存在下在低温下反应来制备二氰酸酯。氰酸酯基经过三聚形成s-三嗪环并产生具有高交联密度的热固性化合物。 Shimp等人 1 和Lin等人 2 分别合成了具有不同主链结构和性质的各种氰酸酯。在过去的十年中,开发了许多新的氰酸酯。例如,Wang等。 3 Snow等人制备了高T g 的酚酞基氰酸酯。制备了具有较低的T g ,介电常数,临界表面张力和吸水率的氟甲基氰酸氰酸酯。 4 Lin等。制备了一种由于脂肪族双戊烯结构的疏水性而具有低吸湿性和低介电性能的含双戊烯的氰酸酯。 5 尽管聚氰酸酯显示出令人鼓舞的性能,但缺乏阻燃性是用于电子应用的氰酸酯的缺点是需要满足阻燃标准UL-94 V-0。文献报道,通过掺入磷元素可以大大提高氰酸酯的阻燃性。 6-9

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