首页> 外文会议>Proceedings of the 2011 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems >Fabrication of PZT thick film on platinum-coated silicon substrate by an improved sol-gel deposition method
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Fabrication of PZT thick film on platinum-coated silicon substrate by an improved sol-gel deposition method

机译:改进的溶胶-凝胶沉积法在铂包硅衬底上制备PZT厚膜

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This article has proposed the fabrication of thick films of lead zirconate titanate (PZT) on a Pt/Ti/SiO2/Si substrate using an improved sol-gel method. To achieve thicker PZT films within reasonable working time, this paper adopts sol-gel coating method but using PZT slurry which contains well dispersed and ball-milled sub-micrometer PZT powders in a sol-gel precursor solution. The PZT slurry is then spin-coated onto a substrate followed by pyrolysis thermal treatments. To enhancing the PZT film qualities, an improved vacuum infiltration treatment has been implemented in addition to conventional sol-gel coating and thermal processing. With the above-mentioned improvements, thicker PZT films with excellent characteristics are obtained. Microstructure and cross-section have been characterized by means of scanning electron microscopy (SEM). The ferroelectric property has been also determined by the ferroelectric analyzer. Films with a thickness in the range from 2.4 µm to 12.8 µm can be obtained within hours by the improved sol-gel method. When the thickness of the film is 12.8 µm, the maximum remanent polarization is 24.48 µC/cm2 and the coercive field is 122.72 kV/cm at the maximum electric field, 625kV/cm. These PZT films are ready for device applications.
机译:本文提出了一种使用改进的溶胶-凝胶法在Pt / Ti / SiO 2 / Si衬底上制备锆钛酸铅(PZT)厚膜的方法。为了在合理的工作时间内获得更厚的PZT膜,本文采用溶胶-凝胶涂布法,但使用的PZT浆液在溶胶-凝胶前体溶液中包含分散良好且经球磨的亚微米级PZT粉末。然后将PZT浆液旋涂到基材上,然后进行热解热处理。为了提高PZT膜的质量,除了常规的溶胶-凝胶涂覆和热处理之外,还实施了改进的真空渗透处理。通过上述改进,获得了具有优异特性的较厚的PZT膜。显微结构和横截面已经通过扫描电子显微镜(SEM)表征。铁电性能也已经由铁电分析仪确定。通过改进的溶胶-凝胶法,可以在数小时内获得厚度在2.4 µm至12.8 µm范围内的薄膜。当膜的厚度为12.8 µm时,最大剩余极化强度为24.48 µC / cm 2 ,在最大电场625kV / cm处的矫顽场为122.72 kV / cm。这些PZT膜已准备就绪,可用于设备应用。

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