DEVELOPMENT OF THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATING POLYMER COMPOSITES FOR ELECTRONIC PACKAGING APPLICATIONS

摘要

This paper discusses the development and modeling of novel polymer composites that possess multifunctional properties demanded by electronic packaging applications. In this work, a thermal conductivity analyzer was designed and implemented to measure composites' effective thermal conductivity (k_(eff)). An analytical model was established to predict k_(eff) of composites filled with spherical fillers. Using this model, together with experimentally-measured k_(eff), a semi-empirical approach was developed to study the effects of polymer-filler interfacial properties on k_(eff).