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Thermally conductive filled polymer composites for mounting electronic devices and method of application
Thermally conductive filled polymer composites for mounting electronic devices and method of application
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机译:用于安装电子设备的导热填充聚合物复合材料及其应用方法
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摘要
A thermally conductive conformable interface layer for use in mounting electronic devices such as transistors or the like onto the surface of a chassis or heat sink. The thermally conductive interface material forms a highly conductive thermal bridge or transfer medium between the external surfaces of the electronic device and the heat sink. The thermally conductive material comprises a multi-layer laminate, typically a polymeric thermally conductive layer along with a film of adhesive bonded thereto. The polymeric layer is preferably a silicone resin, such as polydimethylsiloxane blended with a thermoplastic adhesive such as linear saturated polyester. The polydimethylsiloxane may be filled with a thermally conductive material such as graphite with an adhesive layer being utilized to attach the polymeric layer onto the device and heat sink.
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