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MESO-SCALE ANALYSIS OF INTERFACE ROUGHNESS EFFECT ON DELAMINATION OF POLYMER/METAL INTERFACES

机译:界面粗糙度对聚合物/金属界面脱层影响的中尺度分析

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Delamination is one of the major failure modes occurring in micro- and nano-electronics. In the past, several numerical techniques have been applied to predict the delamination behavior of such electronic devices, such as the J-integral, VCCT, cohesive zone elements and the area release energy approach. Although these methods have been applied successfully, they suffer from a major drawback: due to their phenomenological character, these continuum-scale models rely on extensive experimental characterisation to quantify the model parameters. A multi-scale approach could possibly prevent such extensive characterisation work. Here, information resulting from interactions at different scales are incorporated in the continuum-based models. This paper investigates the effect of one of such interaction at the meso-scale, mechanical interlocking, on delamination of a metal-polymer interface. A meso-scale numerical fracture mechanics model is developed. The model consists of two materials bonded solely by chemical and physical interactions. The mechanical interlocking is taken into account by the geometric profile of the interface. Consequently, macroscopic delamination is assumed to be determined by adhesive failure, cohesive failure or a combination of both at the meso-scale. The model is used to quantitatively predict the competition between cohesive and adhesive failure dependent on characteristic interface roughness parameters. An alternative semi-analytic approach is suggested to decrease computational costs. A validation method for the meso-scale analysis is presented. It consists of peel tests and surface analysis of the original and delaminated interfaces to verify the amount of cohesive and adhesive failure. It is proposed to utilize the mesoscale model to quantify macroscopic interface properties while incorporating the influence of the surface roughness. These properties can be used in macro-scale analysis.
机译:分层是发生在微电子和纳米电子领域的主要失效模式之一。过去,一些数值技术已应用于预测此类电子设备的分层行为,例如J积分,VCCT,内聚区元素和面积释放能量方法。尽管这些方法已成功应用,但它们具有一个主要缺点:由于它们的现象学特征,这些连续尺度模型需要大量的实验表征来量化模型参数。多尺度方法可能会阻止这种广泛的表征工作。在这里,基于不同尺度的交互产生的信息被并入基于连续体的模型中。本文研究了介观尺度的这种相互作用之一(机械互锁)对金属-聚合物界面分层的影响。建立了中尺度数值断裂力学模型。该模型由仅通过化学和物理相互作用结合的两种材料组成。接口的几何轮廓考虑了机械互锁。因此,宏观上的分层被认为是由中观尺度上的粘合破坏,内聚破坏或两者的结合所决定的。该模型用于根据特征界面粗糙度参数定量预测内聚力和胶粘剂失效之间的竞争。建议使用另一种半分析方法来减少计算成本。提出了一种中尺度分析的验证方法。它包括原始界面和分层界面的剥离测试和表面分析,以验证内聚和粘合失败的程度。提出利用中尺度模型来量化宏观界面性质,同时纳入表面粗糙度的影响。这些属性可用于宏观分析。

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