Dependence of IGBT Junction-Case Steady State Thermal Resistance on Heating Current

摘要

High heating current dependence of the IGBT module junction-case steady state thermal resistance is investigated. The conception of the thermal resistance and the physical structure of the IGBT module and the thermal impedance test principle are briefly introduced. The junction-case thermal resistance can be deduced by Finite Element Method in the numerical simulator ANSYS. The transient thermal impedance curve and the junction-case steady state thermal resistance of a certain type of IGBT are obtained by the thermal resistance test experiments. It's found that the junction-case steady state thermal resistance decreased when the heating current increased. When the high heating current reaches a certain level, the steady state thermal resistance becomes a constant.