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Origin of the deep reset and low variability of pulse-programmed WAl2O3TiWCu CBRAM device

机译:脉冲编程WAL2O3TIWCU CBRAM器件的深度重置和低可变性的原点

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In this paper we demonstrate for the first time the origin of the deep reset and low switching variability obtained on pulse-programmed (100ns) 90nm-size WAl2O3TiWCuCBRAM device operated at 10 μA. To this aim we develop a Quantum-Point-Contact (QPC) model describing the conduction of the CBRAM states down to deep current levels, allowing to estimate the effective size of the defect particles in the QPC constriction. The model clearly points to smaller particles for CBRAM (Cu particles) as compared to OxRRAM (oxygen-vacancy Vo defects). As a consequence, smaller constrictions (thus larger resistance) may be obtained in CBRAM after reset. In addition, the fluctuation of the number of these small Cu particles in the constriction has lower impact on Random-Telegraph-Noise (RTN), as compared to Vo defects. Finally, the lower switching variability obtained for CBRAM as compared to OxRRAM is also attributed to the larger mobility of Cu ions as compared to Vo particles in Al2O3 medium.
机译:在本文中,我们在脉冲编程(100ns)90nm尺寸Wal2O3TiWCCBRAM器件上首次证明了在第一次获得的脉冲编程(100ns)90nm尺寸Wal2o3TiWCCBRAM器件上获得的始终处于10μA的原点。为此目的,我们开发了描述了将CBRAM状态传导下降到深电流水平的量子点接触(QPC)模型,从而估计QPC收缩中的缺陷颗粒的有效尺寸。与OxRRAM(氧气空位VO缺陷)相比,该模型显然指向CBRAM(Cu颗粒)的较小粒子。结果,在复位后可以在CBRAM中获得较小的收缩(因此较大的电阻)。另外,与VO缺陷相比,收缩中这些小Cu颗粒的数量的波动对随机电报噪声(RTN)的影响较低。最后,与氧化雷姆相比,对CBRAM获得的较低的切换可变性也归因于与Al 2 O 3培养基中的VO颗粒相比Cu离子的较大迁移率。

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