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Reliability challenges in 3D NAND Flash memories

机译:3D NAND闪存记忆中的可靠性挑战

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The reliability of 3D NAND Flash memory technology is depending on many factors. Most of them are related to the process-induced variability of the layers. Endurance, data retention capabilities, and cross-temperature immunity are the metrics that become affected by this, turning in peculiar reliability challenges that are difficult to be tackled without the aid of system level solutions. In this work we show how some of the Flash Signal Processing techniques implemented in memory controllers like machine learning and read oversampling algorithms can help in the overall improvement of the 3D NAND Flash reliability.
机译:3D NAND闪存技术的可靠性取决于许多因素。其中大多数与图层的过程引起的变异性有关。耐力,数据保留能力和交叉温度免疫力是受此影响的指标,在​​没有系统级别解决方案的帮助下难以解决的特殊可靠性挑战。在这项工作中,我们展示了在机器学习和读取过采样算法等存储器控制器中实现的一些闪光信号处理技术如何帮助3D NAND闪存可靠性的总体改进。

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