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Solution for PCM and OTS Intermixing on Cross-Point Phase Change Memory

机译:PCM和ITS混合在交叉点相变内存中的解决方案

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摘要

A reliability study for PCM and OTS intermixing was addressed. The buffer layer between PCM and OTS plays a key role in preventing PCM/OTS intermixing after BEOL processing thermal treatment. Besides cycling endurance, performance degradation due to interlayer intermixing was observed. Optimal device operation and an improved buffer layer allowed drastically improved cycling endurance from a few cycles to > 1E9 cycles.
机译:解决了PCM和ITS混合的可靠性研究。 PCM和OTS之间的缓冲层在防止BEOL处理热处理后的PCM / OTS混合中发挥着关键作用。除了循环耐久性外,观察到由于中间层混合引起的性能降解。最佳装置操作和改进的缓冲层允许从几个循环到> 1E9循环的循环急促改善循环耐久性。

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