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PENETRATION PERFORMANCE OF ULTRAFINE-GRAINED COPPER SHAPED CHARGE LINER

机译:超细颗粒铜形电荷衬里的渗透性能

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It is known that the fine grain size of a copper shaped charge liner improves penetration performance. To obtain fine microstructure in copper, recrystallization after plastic deformation is usually used. In this study, ultrafine grain of copper was obtained by a severe plastic deformation technique called equal channel angular pressing (ECAP). Conical liners were fabricated from ECAP processed billets. Mechanical properties and penetration performances of ultrafine-grained copper shaped charge liners have been compared with those of conventionally forged and recrystallized ones.
机译:众所周知,铜形电荷衬里的细粒尺寸提高了渗透性。为了获得铜中的细微结构,通常使用塑性变形后的重结晶。在这项研究中,通过严重的塑性变形技术获得铜的超细晶粒,称为等沟角压(ECAP)。锥形衬垫由ECAP加工的钢坯制造。与常规锻造和重结晶的铜形电荷衬里的机械性能和穿透性能进行了比较。

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