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Improving the properties of metallic materials by surface alloying induced with a pulsed electron beam

机译:通过脉冲电子束引起的表面合金化改善金属材料的性能

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Surface alloying of metallic materials implemented by a liquid-phase mixing of thin deposited film with upper layer of substrate using a low-energy, high-current electron beam (LEHCEB) has been investigated. In surface alloying, LEHCEB has been employed as a source of energy that is delivered to the near-surface layer of the workpiece and released there. The electron-beam parameters were: 2–3 µs pulse duration and 30 keV maximum electron energy. Deposition of metallic films was performed by means of magnetron sputtering. Systems of metals examined were Zr-Ti, Ni-Cu as well as Stainless Steel deposited on Cu substrate. Investigation of cross-section of the samples revealed that concentration of the substrate material changes gradually from 100 in the bulk to almost 0% at the surface. In contrast, the concentration of the alloyed material changes from 0 in the bulk to about 100% at the surface. In such a way the composition of formed surface alloy represents two different metallic materials bonded via a transition layer. Investigations of properties of Cu electrodes alloyed by Ni showed in particularly that they reveal improved electric strength of vacuum insulation compared to that for the initial and LEHCEB-irradiated electrodes made of pure copper.
机译:已经研究了金属材料的表面合金化,该合金化是通过使用低能大电流电子束(LEHCEB)将沉积薄膜与衬底上层进行液相混合而实现的。在表面合金化中,LEHCEB已被用作能量来源,该能量被传递到工件的近表层并在那里释放。电子束参数为:2–3 µs脉冲持续时间和30 keV最大电子能量。金属膜的沉积通过磁控溅射进行。检查的金属系统为Zr-Ti,Ni-Cu以及沉积在Cu基底上的不锈钢。样品横截面的研究表明,基质材料的浓度从本体中的100逐渐变化为表面上的几乎0%。相反,合金材料的浓度从整体上的0变化到表面上的大约100%。以这种方式,形成的表面合金的成分代表了通过过渡层粘结的两种不同的金属材料。对Ni合金化的Cu电极性能的研究特别表明,与纯铜制成的初始电极和LEHCEB辐照电极相比,它们显示出更高的真空绝缘电强度。

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