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The welding tendency of CuCr contact materials in vacuum

机译:真空中CuCr触头材料的焊接趋势

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摘要

Diffusion welding tests of vacuum casting Cu-30Cr, Cu-30CrZr, Cu-30CrTe and Cu-30CrZrTe alloy contact materials as well as sintered CuCr25 p/m contact materials were performed in the vacuum chamber of Gleeble 3500, and the joining forces of the welded pairs were measured by tensile test at ambient temperature. Characteristics of fracture surfaces were analyzed by optical microscope and SEM. It shows that the joining force and strength decrease in the order of Cu-30CrZr, Cu-30Cr, Cu-30CrZrTe, CuCr25 and Cu-30CrTe contact materials; fractographs of these contact materials show different fracture mechanisms. These results show that the joining force of the welded specimen depends mainly on the bonding force of the interface of Cr and Cu phases. Therefore, the modified structure and behavior of the interface of Cu/Cr phases by adding micro-alloying Te to decrease properly the bonding force of interface of Cr/ Cu phases will crucially improve the welding behavior of Cu-Cr alloy contact materials. Thereby, the possibility to improve the anti-welding property of available CuCr contact materials further and the potential fusion-welding problem of some VCB with lower contact force are discussed.
机译:在Gleeble 3500的真空室中进行了真空铸造Cu-30Cr,Cu-30CrZr,Cu-30CrTe和Cu-30CrZrTe合金接触材料以及烧结的CuCr25 p / m接触材料的扩散焊接测试,焊接对在环境温度下通过拉伸试验进行测量。用光学显微镜和SEM分析断裂表面的特征。结果表明,连接力和强度按Cu-30CrZr,Cu-30Cr,Cu-30CrZrTe,CuCr25和Cu-30CrTe接触材料的顺序减小;这些接触材料的分形仪显示出不同的断裂机理。这些结果表明,焊接试样的结合力主要取决于Cr和Cu相界面的结合力。因此,通过添加微合金化Te来适当降低Cr / Cu相界面的键合力,从而改变Cu / Cr相界面的结构和行为,将极大地改善Cu-Cr合金触头材料的焊接性能。因此,讨论了进一步改善现有的CuCr接触材料的抗焊接性能的可能性,以及某些具有较低接触力的VCB的潜在熔焊问题。

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