Fluidic self-assembly of millimeter scale thin parts on preprogrammed substrate at air-water interface

摘要

This paper presents a novel method to achieve high yield assembly of millimeter-scale thin silicon chips from an air-water interface. Surface functionalized silicon parts (1000 × 1000 × 100 ¿m³) assemble in preprogrammed hydrophilic locations on a wafer substrate with self-alignment. We optimized the process and design factors systematically using DOE (Design of Experiment) that leads to high yield (100%).