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Two-phase flow boiling of R134a in a multi-microchannel heat sink for microprocessor cooling

机译:R134a在多微通道散热器中的两相流沸腾,用于微处理器冷却

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The following study concentrates on two-phase flow boiling of refrigerant R134a inside two similar copper multi-microchannel heat sinks, one of which was designed for singlephase water cooling of microprocessors. The two-phase heat sink was composed of 100 parallel microchannels, 100 µm wide, 680 µm high, 15 mm long with 72 µm-thick fins, and 63 parallel microchannels. Base heat fluxes and channel-based mass fluxes were varied from 2.57 to 190 W/cm2 and from 205 to 1000 kg/m2 s, all at a nominal saturation temperature of 63°C. Local heat transfer coefficients were measured at 35 locations using localized heaters and temperature sensors. The main trend identified was that the heat transfer coefficient increased with heat flux at all vapor qualities and mass fluxes tested. Heat transfer coefficients as high as 250''000 W/m2K (relative to the base area) were reached, keeping the chip under 85°C. Backflow and flow instabilities were the main issues with the single-phase heat sink when used in flow boiling, leading to flow mal-distribution and jet impingement effects.
机译:以下研究集中于两个类似的铜多微通道散热器内制冷剂R134a的两相流沸腾,其中一个设计用于微处理器的单相水冷。两相散热器由100个平行微通道,100μm宽,680μm高,15 mm长,72μm厚的散热片和63个平行微通道组成。基本热通量和基于通道的质量通量均在标称饱和温度下变化,范围从2.57至190 W / cm 2 和205至1000 kg / m 2 s的温度为63°C。使用局部加热器和温度传感器在35个位置测量了局部传热系数。确定的主要趋势是,在所有测试的蒸汽质量和质量通量下,传热系数均随热通量的增加而增加。达到高达250'000 W / m 2 K(相对于基面积)的传热系数,将芯片保持在85°C以下。当用于流动沸腾时,回流和流动不稳定性是单相散热器的主要问题,从而导致流动分布不均和射流撞击效应。

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