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A small form-factor and low-cost opto-electronic package for short-reach 40 Gbit/s serial speed optical data links

机译:小型,低成本的光电封装,用于短距离40 Gbit / s串行速度光学数据链路

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For the first time we present a small form-factor, low-cost package that is suitable for transmitter optical subassemblies (TOSAs) and receiver optical subassemblies (ROSAs) with serial speeds up to 40 Gbit/s. The TOSA includes a very high speed vertical cavity surface emitting laser (VCSEL) and a driver integrated circuit (IC) inside the package and the ROSA combines a high speed photodiode (PD) with a transimpedance amplifier (TIA) IC. The overall housing concept is based on a TO-can (Transistor Outline) packaging technology in order to realize a hermetically-sealed, high volume and low cost prototype product solution. The radial dimensions of the TOSA/ROSA package are selected to fit easily within standard optical transceiver form-factors for example SFP and QSFP (quad small form-factor pluggable).
机译:我们首次展示了一种小型,低成本封装,适用于串行速度高达40 Gbit / s的发射器光学子组件(TOSA)和接收器光学子组件(ROSA)。 TOSA在封装内部包括一个非常快的垂直腔表面发射激光器(VCSEL)和一个驱动器集成电路(IC),ROSA结合了一个高速光电二极管(PD)和一个跨阻放大器(TIA)IC。总体外壳概念基于TO-can(晶体管轮廓)封装技术,以实现密封,大批量,低成本的原型产品解决方案。选择TOSA / ROSA封装的径向尺寸可轻松放入标准的光收发器规格范围内,例如SFP和QSFP(可插拔小型规格)。

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