ADHERENT CARBON-BASED FILMS EXHIBITING HIGH ELECTRICAL CONDUCTIVITY

摘要

Carbon-based films of thickness ranging from 1 to 13 μm, with electrical resistivity ranging from 0.0006 to 3 Ω.cm were produced on an alumina substrate, using as the carbon precursor EPON SU 2.5 epoxy and an amine curing agent, and a carbonization temperature of 650°C. This precursor, plus a solvent or filler(s), gave carbon films without cracks and with good edge definition, in contrast to the poor edge definition when either polyamide or amidoamine (with low amine hydrogen equivalent weights) was used instead of the amine as the curing agent. Interconnected filamentary nickel nanoparticles were more effective for conductivity enhancement than silver nanoparticles (not filamentary) at the same volume fraction (5 vol.% or below) and multiwalled carbon nanotubes. They were less effective than nickel nanoparticles in spite of their high aspect ratio. The filler volume fractions are much lower than those in prior related work, and are therefore attractive for good bonding to the substrate, high processability and low cost.