首页> 外文会议>Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008) >Frequency Dielectric Constant and Loss Tangent Extracting of Organic Material Using Multi-length Microstrip
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Frequency Dielectric Constant and Loss Tangent Extracting of Organic Material Using Multi-length Microstrip

机译:多长度微带提取有机材料的频率介电常数和损耗角正切

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Organic material using for packaging substrate is selected and multi-length microstrip lines in same trace width are designed and performed on it. Novel formulas deliver to extract dielectric constant and loss tangent varying with frequency for selected organic materials will be shown in this paper. Performances of microstrip lines are measured by Agilent Vector Network Analyzer up to 20GHz and SOLT calibration used to get two-port S-parameters. Then, novel formulas are used to extract material parameters in ADS software by measurement date.
机译:选择用于包装基板的有机材料,并在其上设计并执行具有相同走线宽度的多长度微带线。本文将展示用于提取介电常数和损耗正切随频率变化的新公式,以用于所选的有机材料。微带线的性能是通过高达20GHz的安捷伦矢量网络分析仪测量的,并通过SOLT校准来获得两端口S参数。然后,使用新公式根据测量日期在ADS软件中提取材料参数。

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