Study on the Integrated Quality Information Systems of Semiconductor Packaging Processes

摘要

Based on the study of the processes of semiconductor packaging, three integration models were put forward. One is a static integration model based on the products, materials, specifications and devices. The other is a dynamic model based on the manufacturing orders and the manufacturing processes. The third one is an integration model of all kinds of quality tools based a central database, the quality tools include SPG ( Statistical Process Control) , Design of Experiment (DOE) , MSA (Measurement System Analysis) , et al. Based on these models, a framework of integrated quality information system for semiconductor packaging is studied. Through this framework, large-scale quality data, manufacturing processes and the quality tools can be integrated effectively. At last, a prototype was developed based on SQL Server2000 and Microsoft visual sutdio. net