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PHOTOVOLTAGE METHOD EMPLOYED FOR MONITORING OF SILICON SOLAR CELL TECHNOLOGY

机译:用于硅太阳能电池技术的光电压监测方法

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The monitoring of c-Si wafer quality and cell production technology is the main purpose of this work. To characterize the silicon material during the process of the cell preparation, diffusion length of minority carriers Lwas chosen. The wavelength dependence of modified surface photovoltage (SPV) experiment was used as a cheapand reliable method of its evaluation. The SPV spectra of wafers for solar cells after etching of only a fewmicrometers (less than 20 μm) show a broadening of spectral response towards the IR region, which is probablycaused by some kind of structural defects formed as a consequence of Si ingots slicing. Successive etching removingup to 65 μm thick layer (from each side) was performed pointing out that for some wafers only such a deep etchingwas enough to remove totally the defect layer resulting in a smooth curve yielding standard diffusion length L about300 μm. On the other hand, neither the samples with p-n junction created onto the wafers not etched enough showpresence of SPV broadening effect. The SPV spectrum is consequently not deformed but the short diffusion lengthevaluated gives evidence of possible deep recombination center formation.in the subsurface layer. Quite deep etchingof sawn-off wafers or annealing in atomic hydrogen atmosphere is proved to prevent shortening of diffusion lengthand when keeping the surface recombination velocities low enough, to reach higher efficient solar cells.
机译:监测c-Si晶片质量和电池生产技术是这项工作的主要目的。为了表征细胞制备过程中的硅材料,少数载流子的扩散长度L 被选中。廉价使用修饰表面光电压(SPV)实验的波长依赖性 可靠的评估方法。蚀刻后的太阳能电池晶片的SPV光谱 微米(小于20μm)显示出对IR区域的光谱响应变宽,这可能是 由于硅锭切片而形成的某种结构缺陷造成的。连续蚀刻去除 进行了高达65μm厚的涂层(从每一面开始),并指出对于某些晶圆来说,只有如此深的蚀刻 足以完全去除缺陷层,从而形成一条平滑曲线,从而产生标准扩散长度L,约为 300微米另一方面,在晶圆上未充分蚀刻的具有p-n结的样品均未显示 SPV增宽作用的存在。因此,SPV光谱不会变形,但扩散长度短 被评估的结果提供了在地下层可能形成深层重组中心的证据。相当深的蚀刻 锯切晶圆的切割或在原子氢气氛中的退火被证明可以防止扩散长度的缩短 当保持足够低的表面重组速度时,可以达到更高效率的太阳能电池。

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