首页> 外文会议>Pressure Sensitive Tape Council TECH XXVIII Technical Seminar >NEW FORMULATION TECHNIQUES FOR ACRYLIC UV CURABLE PRESSURE SENSITIVE HOTMELT ADHESIVES
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NEW FORMULATION TECHNIQUES FOR ACRYLIC UV CURABLE PRESSURE SENSITIVE HOTMELT ADHESIVES

机译:丙烯酸紫外线固化压力敏感热熔粘合剂的新配方技术

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UV curable pressure sensitive hotmelt adhesives are successfully have been used for label, tape and self adhesive insulation materials for several years. Although there is only a limited range of crosslinkable raw materials available, formulation of these materials has opened a wide range of new adhesives. Adhesive formulation is needed to tailor a product to specific application or customer requirements. Besides conventional formulation with non-reactive tackyfier resins, Collano discovered additional routes. Compounding with UV reactive additives results in chanced viscosity and adhesion properties. In the presence of a UV curable base resin, these additives do not require a further photoinitiator system and establish a covalent bond to the base polymer. The chemical bond between additive and base polymer, results in very low out-gassing or fogging values. Furthermore the additives reduce the melt viscosity significantly and make the products suitable for direct coating of temperature sensitive materials like polyethylene. The reduced melt viscosity further opens the possibility to utilize specialty additives like thermal expandable fillers. The novel formulation technique adds another dimension to satisfy the market needs with UV curable pressure sensitive adhesives and therefore further develop an environmentally safe adhesive technology.
机译:UV可固化压力敏感的热熔粘合剂已成功用于标签,胶带和自粘绝缘材料几年。虽然只有有限的可交联原材料可用,但这些材料的配方开辟了各种新粘合剂。需要粘合剂制剂来定制产品到特定的应用或客户要求。除了具有非反应性塔克赖夫树脂的常规配方外,Collano发现了额外的途径。用UV反应性添加剂配制导致趋沸性粘度和粘合性能。在UV可固化基础树脂存在下,这些添加剂不需要另外的光引发剂体系并与基础聚合物建立共价键。添加剂和基础聚合物之间的化学键,导致非常低的外辐射或雾化值。此外,添加剂显着降低熔体粘度,使产品适用于直接涂覆的温度敏感材料,如聚乙烯。降低的熔融粘度进一步打开了利用热膨胀填料等特种添加剂的可能性。新型配方技术增加了另一种尺寸,以满足UV可固化压力敏感粘合剂的市场需求,从而进一步开发一种环境安全的粘合技术。

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