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STEAG HamaTech Resist Coater ASR5000 - tool concept and process results -

机译:STEAG HamaTech Resist Coater ASR5000-工具的概念和工艺结果-

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摘要

Utilizing the balance of capillary forces and adhesion, a liquid material, e.g. photo resist, can be applied to the surface of a face down mounted substrate. STEAG HamaTech's Advanced single Substrate Resist coater, ASR5000, is combining patented capillary apply technology, and a patented face-down spin process, to enable fringe free uniform coatings on rectangular substrates. CAP COAT~(~R)ing technology reduces resist consumption by a factor of at least 10 over conventional coating methods. Face down spin, provides highly uniform resist spread without risk of backside contamination. The principle equipment concept and capability is presented. Coating and bake performance is discussed for IP3600 and ZEP7000A. Coating uniformities, of smaller +-0.7% at a 4500A thick IP3600 film and smaller +-0.4% at a 3000A thick ZEP7000A resist film were achieved, respectively. The repeatability of the coating performance and the post coat bake process (PCB) are demonstrated.
机译:利用毛细作用力和附着力之间的平衡,使用液体材料,例如可以将光刻胶应用于面朝下安装的基板的表面。 STEAG HamaTech的高级单基材抗蚀剂涂布机ASR5000结合了获得专利的毛细管涂布技术和获得专利的面朝下旋涂工艺,可在矩形基材上实现无条纹的均匀涂层。与传统的涂层方法相比,CAPCOAT®涂层技术将抗蚀剂消耗降低了至少10倍。面朝下旋转,提供高度均匀的抗蚀剂扩散,而没有背面污染的风险。介绍了主要的设备概念和功能。讨论了IP3600和ZEP7000A的涂层和烘烤性能。在4500A厚的IP3600薄膜上,涂层的均匀度分别为±0.7%和3000EPA的ZEP7000A抗蚀剂薄膜上的±0.4%。证明了涂层性能和涂覆后烘烤工艺(PCB)的可重复性。

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