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A NOVEL INTEGRATED PYROMETER - EMISSOMETER WHICH ENABLES ACCURATE TEMPERATURE MEASUREMENTS OF SURFACES WITH UNKNOWN EMISSIVITIES

机译:新型集成热释光仪-可以对未知发射率的表面进行精确的温度测量

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Rapid thermal processing (RTP) is used for many steps during the manufacturing process of microelectronic circuits. The electrical properties of semiconductor devices are very sensitive to thermal process control. For example some processes require thermal ramp rates of up to hundreds of degrees Celsius per second, temperature repeatability of as little as 2 °C (@ 1000 °C), while maintaining temperature uniformity to within a few degrees across the wafer. To meet these requirements without introducing contaminants, radiation pyrometers are used to measure and control wafer temperatures. However, wafer emissivities vary greatly requiring active measurement and compensation of emissivity during wafer processing. This paper describes the development of a pyrometer with an integrated emissometer. This novel instrument determines the effective emittance of a wafer by measuring changes in radiance as a function of view angle when the wafer is in an RTP chamber. Models of the functional emissivity dependence have been determined by Monte-Carlo methods that describe the relationship of the pyrometer optics, processing chamber, and the wafer surface. Measurements of the bi-directional reflectance distribution function (BRDF) of the critical surfaces were incorporated into the model. This technique has been successfully implemented into the current generation of high performance production RTP tools
机译:快速热处理(RTP)在微电子电路的制造过程中用于许多步骤。半导体器件的电特性对热过程控制非常敏感。例如,某些工艺要求每秒高达数百摄氏度的热升温速率,低至2°C(@ 1000°C)的温度重复性,同时将整个晶圆的温度均匀性保持在几度之内。为了在不引入污染物的情况下满足这些要求,使用辐射高温计来测量和控制晶片温度。但是,晶片的发射率变化很大,需要在晶片处理过程中进行主动的测量和发射率的补偿。本文介绍了带集成辐射计的高温计的开发。当晶片位于RTP腔室中时,这种新颖的仪器通过测量辐射度随视角变化的变化来确定晶片的有效发射率。通过蒙特卡洛方法确定了功能发射率相关性的模型,这些模型描述了高温计光学器件,处理室和晶片表面之间的关系。关键表面的双向反射率分布函数(BRDF)的测量已合并到模型中。该技术已成功应用于当前的高性能生产RTP工具中

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