首页> 外文会议>59th Society of Plastics Engineers Annual Conference >SIMULATION OF THE PUNCTURE RESISTANCE OF A THERMOFORMED SYRINGE PACK
【24h】

SIMULATION OF THE PUNCTURE RESISTANCE OF A THERMOFORMED SYRINGE PACK

机译:热成型注射器包装的穿刺阻力模拟

获取原文

摘要

A potential material change for a medical packaging thermoformed pack requires costly and time-consuming re-validation. One of the major issues associated with this is the puncture resistance of the pack. This study considers a non-isothermal computational fluid dynamics (CFD) analysis of the thermoforming process of a syringe pack, followed by a non-linear structural analysis of the formed pack to estimate puncture resistance. In this way the final shape and thickness distribution of the thermoformed pack are included in the structural analysis. Two reference materials will be used in validating the usefulness of the technique.
机译:医疗包装热成型包装的潜在材料更改需要昂贵且耗时的重新验证。与之相关的主要问题之一是包装的抗穿刺性。这项研究考虑了注射器包装热成型过程的非等温计算流体动力学(CFD)分析,然后是成型包装的非线性结构分析以估计抗穿刺性。这样,热成型包装的最终形状和厚度分布就包括在结构分析中。将使用两种参考材料来验证该技术的实用性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号