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Optimization of Chemical-Mechanical Planarization (CMP) from the Viewpoint of Consumable Effects

机译:从消耗效应看化学机械平面化(CMP)的优化

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Systematic methods for the optimization of CMP from the viewpoint of consumable effects are discussed. Two methods, one, precision control and design of the pad topography, second, precision control and design of the abrasive size distribution are proposed to optimize the material removal rate and non-uniformity in CMP based on a material removal model.
机译:从耗材效应的角度讨论了优化CMP的系统方法。提出了两种方法,一种是基于垫块形貌的精确控制和设计,其次是基于材料去除模型来优化CMP中的材料去除率和不均匀性的磨料粒度分布的精确控制和设计。

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