A novel approach for flip chip solder joint quality inspection based on vibration analysis is presented. Traditional solder joint inspection methods have their limitations when applied to flip chip solder joint quality inspection. The vibration detection method is a new approac which has advantages such as being non-contact, non-destructive, fast and can be used on-line or during process development. In this technique, a flip chip was modeled as a thick plate supported by solder bumps. Changes in solder joint quality produce different vibration responses of flip chip, and change tis natural vibration frequencies. In this paper, the vibration frequencies of a flip chip on a ceramic substrate were calculated using the finite element method. Based on vibration analysis, a laser ultrasound and interferometric system was developed for flip chip solder joint quality inspection. In this system, chips with good solder their vibration responses and frequencies. Defects recognition methods were developed and tested. Results indicate this approach offers great promise for soler bump inspection in flip chip, BGA and chip scale packages.
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