New Paradigms in Electronics Cooling Engineering

摘要

As targets for future growth of aluminum products, we sees greatest opportunity in the three areas of automotive, energy and electronics. Within electronics, uses of aluminum include capacitor materials, magnetic disk substrates, printer/copier durums, and heastinkds. Of the first three areas, other materials may soon replace aluminum. In heastinks, the high thermal condictivity, low density and low material cost of aluminum proeduce serious competition from other materials. Cooling technology for modern servers, workstantions and desktop computers has just begun a period of rapid change. As processor powers approach 100 watts, longstanding limits of air cooling are being challenged. The most recent changes are in the heatsinks themselves, as the longstanding manufacturing process of extruding is no longer capable of meeting new performance requirements. Skiving and floded fins, both established manufacturing technologies which can proivde much finer features than extruding, are leading candidates for mass production of the new generation of heastinks.