High rate sputter deposition of TiO_2 from TiO_(2-x) target

摘要

New sputter technique for high ratedeposition of TiO_2 was developed for applying to conventional planar magnetron DC sputter system. In this technique, TiO_2 films are deposited by using the plasma sprayed TiO_(2-x) target and Ar sputter gas containing a few percent of O_2 gas. The deposition rate efficiency was almost 8 times larger than that of the conventional sputter method using Ti target and O_2 sputter gas. According to ESCA analysis, it is suggested that the high deposition rate efficiency comes from the metallic target surface during the sputtering.