Advanced Via Filling Methods for Hdis Applications

摘要

Build-Up Multilayer (BUM) construction has been identified as an enabling technology for Printed Circuit Board (PCB) and Integrated Circuit (IC) packaging manufacturers to produce the High Density Interconnect Structures (HDIS) necessary to meet the future demands of portable electronic products. The permanent filling of the through hole vias in the cores used in typical BUM PCB designs is understood to be an important manufacturing process capability for establishing and maintaining a robust The Flat Plug (FP) process is an established method for via filling, based on advanced screenprinting technology that has been proven in mass production in Japan.